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orgで入手可能となる。初版は2000年7月発行。前版は2007年3月発行。
この用語定義文書は半導体用シリコン結晶およびウェーハに関する用語の定義を取り扱う。
The purpose of this Document is to standardize requirements for hexamethyldisilazane used in the semiconductor industry and testing procedures to support those standards
This Classification includes the following:
All such standards have since been revised to use the IOC-88 calibration factor1
G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending Revision:SEMI G96-1014 - Superseded orgで入手可能となる。初版は2000年7月発行。前版は2007年3月発行。* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1
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