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G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 StdPbc-0624 The committee is continuing work

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Description

The committee is continuing work on improvement of specifications and procedures

SEMI E40-0324 (technical revision)

2  This Specification applies to all semiconductor manufacturing equipment that supports the data acquisition interface defined in the SEMI Specification for Data Collection Management

the feedstock for growing semiconductor grade single crystalline silicon (c-Si) as well as silicon wafers

or other functionality that is unique to a class (etchers

G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 StdPbc-0624 The committee is continuing workglobal Assembly and Packaging Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1997200411 Referenced SEMI Standards None.

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