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The purpose of this Specification is to promote industry use of common BGA designs that may be distinguished by their form
This Guide is applicable only to gaseous components which do not react between themselves or with the cylinder walls
SEMI E78 — Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment
本文書は2008年9月に，誤字を訂正するため，編集上の修正がなされた。変更箇所は，¶6
G03800 - SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法 Revision:SEMI G38-0996 (Reapproved 0811) - Superseded the back surfaceglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1987200411 : IC Referenced SEMI Standards SEMI G32 Guideline for Unencapsulated Thermal Test Chip SEMI G42 Specification for Thermal Test Board Standardization for Measuring Junction to Ambient Thermal Resistance of Semiconductor Packages