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SEMI M70 — Practice for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness
SEMI G13-81 (first published)
This document provides standards for implementing and collecting SEMI E10 state changes at the equipment level per SEMI E10
All such standards have since been revised to use the IOC-88 calibration factor1
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title and when it is leftThis document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method